The Electronics Group of Henkel has just launched Loctite Multicore HF 212 a halogen-free solder paste ideal for high value PCB assemblies, and from today, you can purchase this new product from Ellsworth Adhesives Europe.
Like its other halogen-free formulations, Loctite Multicore HF 212 contains zero deliberately added halogen and is under the limit of detection for chlorine and bromine when subjected to rigorous testing. With consistent print performance and minimal hot slump – even in regions with temperatures that exceed 86°F (30°C) and relative humidity (RH) as high as 80% — Loctite Multicore HF 212 offers exceptional stability and environmental adaptability. The material exhibits extremely low voiding in CSP via-in-pad joints, good coalescence and excellent solderability over a wide range of surface finishes including Ni/Au, Immersion Sn, CuNiZn, Immersion Ag and OSP copper.
“While Loctite Multicore HF 212 was obviously designed for sustainability,” explains Henkel Solder Materials Global Product Manager, Mark Currie, “our approach was much more holistic. Customers simply want a single solder paste that delivers excellent performance. With Loctite Multicore HF 212 – and all of our solder pastes for that matter – we ensure the formulation meets demanding soldering requirements in tandem with environmental benefits.”
