new blog

 

The Electronics Group of Henkel has just launched Loctite Multicore HF 212 a halogen-free solder paste ideal for high value PCB assemblies, and from today, you can purchase this new product from Ellsworth Adhesives Europe.

Like its other halogen-free formulations, Loctite Multicore HF 212 contains zero deliberately added halogen and is under the limit of detection for chlorine and bromine when subjected to rigorous testing. With consistent print performance and minimal hot slump – even in regions with temperatures that exceed 86°F (30°C) and relative humidity (RH) as high as 80% — Loctite Multicore HF 212 offers exceptional stability and environmental adaptability. The material exhibits extremely low voiding in CSP via-in-pad joints, good coalescence and excellent solderability over a wide range of surface finishes including Ni/Au, Immersion Sn, CuNiZn, Immersion Ag and OSP copper.

“While Loctite Multicore HF 212 was obviously designed for sustainability,” explains Henkel Solder Materials Global Product Manager, Mark Currie, “our approach was much more holistic. Customers simply want a single solder paste that delivers excellent performance. With Loctite Multicore HF 212 – and all of our solder pastes for that matter – we ensure the formulation meets demanding soldering requirements in tandem with environmental benefits.”

 

This November Ellsworth Adhesives Europe will be appearing at Europe’s leading event for Electronic production – Productronica.

Taking place in Munich from November 12^th – 15^th, Productronica brings together industry experts from across the globe who will present their latest technology and future developments. Ellsworth Adhesives will be showcasing a number of Fisnar Liquid Control products perfectly suited to dispensing for electronic component applications. Find us at Productronica in Hall A4 Booth 407.

 

To find out more about Productronica you can visit the website: www.productronica.com

 

If you are interested in attending please contact Sales Manager, Paul Baird.

 

Ellsworth Adhesives expands its product portfolio with the addition of the new Dymax 9100 range.

Now available for purchase from Ellsworth Adhesives Europe, the new Dymax 9100 series of light-curable encapsulants reaches full cure in shadowed areas and prevents rejects with its quick tack-free curing.

Dymax Dual-Cure 9101, 9102, and 9103 are resilient, chip-encapsulant materials designed with a UV/Visible light and secondary ambient moisture-cure system, making them perfect for encapsulation applications where shadowed areas are present. No refrigeration is required for transporting the uncured 9100 materials, therefore no additional associated costs are incurred.

The 9100 series materials cure tack free after UV cure, so boards can be handled sooner with less potential for damage. Once cured, the materials are flexible and expand with heat, reducing stress on board components. The two-day moisture cure – versus the seven days typical with other systems – shortens the time for further handling as well as final testing and assembly.

The three new products in the 9100 Series have varying viscosities of 7,000, 17,000, and 25,000 cP, allowing for performance and dispensing to be optimized. In addition, the new materials are jet dispensable for more accurate placement and more efficient material usage. Ellsworth Adhesives offers the very latest in dispensing technology, including the new TS9000 Series Jet Valve by Techcon.

The addition of the new 9100 series from Dymax further extends Ellsworth Adhesives impressive product range of printed circuit board assembly materials which includes silicones, conformal coatings and encapsulants as well as UV curing resins and other related products.