Dymax 9309-SC Reinforcement Adhesive – 300g Cartridge

SKU: 0114-01-001439

Dymax 9309-SC adhesive cures upon exposure to UV/Visible light to quickly ruggedize circuit board components. This edgebond material is ideal for applications where shock attenuation or ruggedization is necessary. The material provides rapid bonding to leadframe, PCB, silicon, and ceramic.

The product is ideal for reinforcement of fine-pitch leads or leadless components on printed circuit boards as well as an alternative to underfill. This adhesive is compatible with both needle and jet dispensing systems and is highly thixotropic, minimizing movement after dispensing. 300g Cartridge.

Features & Benefits:

  • Edgebond/CSP reinforcement adhesive
  • Cures with UV/Visible light
  • See Cure - dispenses blue, cures clear
  • Compatible with needle or jet dispensing equipment
  • Highly thixotropic for minimal movement after dispense
  • Reduces stress on board components
  • No solvents added

Size: 300g Cartridge

Normally ships within: Advised at point of enquirySold in quantity of: Advised at point of enquiry


Additional information

Manufacturer part no.

9309-SC/300CRT

Size

300g Cartridge

Sold in quantity of

Advised at point of enquiry

Normally ships within

Advised at point of enquiry

Colour

Blue Transparent

Dymax 9309-SC Product Data Sheet

Download

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