Loctite ECCOBOND UF1173

SKU: 0006-01-000670

Loctite ECCOBOND UF1173 is a one component, black liquid, epoxy underfill created for high reliability electronic applications. It provides interconnect protection from shock, drop and vibration.

ECCOBOND UF1173 is designed to provide a uniform and void-free encapsulating underfill which maximises a device's temperature cycling capability and dissipates stress away from solder joints and connections.

Features & Benefits:

  • One component
  • Void-free underfill
  • Can be needle or jet dispensed
  • Long pot life
  • Low CTE
  • Heat cure
  • Available in 10cc or 55cc

Normally ships within: Advised at point of enquiry


Additional information

Manufacturer part no.

2420247

Size

10cc

Sold in quantity of

Advised at point of enquiry

Normally ships within

Advised at point of enquiry

Colour

Black