Loctite ECCOBOND FP4531 – 10cc

SKU: 0006-01-000156

Loctite ECCOBOND FP4531 is an epoxy-based underfill encapsulant for use on flip-chips on flex applications with gaps down to 1mm. This epoxy-based underfill encapsulant is formulated to flow easily into the small gaps on flex applications.

Loctite ECCOBOND FP4531 has a recommended snap-cure schedule of 7 minutes at 160°C and passes NASA outgassing standards.

Please note, this product is frozen and must be shipped in dry ice. Contact us for more information.

Features & Benefits:

  • Black
  • Snap curable
  • Fast flow
  • Passes NASA outgassing
  • Increases reliability of small-gap flip-chips
  • Heat cure

Sold in quantity of: Advised at point of enquiryNormally ships within: Advised at point of enquiry


Additional information

Manufacturer part no.

446513

Size

10cc

Sold in quantity of

Advised at point of enquiry

Normally ships within

Advised at point of enquiry

Colour

Black

Loctite ECCOBOND FP4531 Technical Data Sheet

Download

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