Additional information
| Manufacturer part no. | 498770 |
|---|---|
| Size | 30cc |
| Sold in quantity of | Advised at point of enquiry |
| Normally ships within | Advised at point of enquiry |
| Colour | Black |
Loctite ECCOBOND FP4531 – 30cc
Loctite ECCOBOND FP4531 is an epoxy-based underfill encapsulant for use on flip-chips on flex applications with gaps down to 1mm. This epoxy-based underfill encapsulant is formulated to flow easily into the small gaps on flex applications.
Loctite ECCOBOND FP4531 has a recommended snap-cure schedule of 7 minutes at 160°C and passes NASA outgassing standards.
Please note, this product is frozen and must be shipped in dry ice. Contact us for more information.
Features & Benefits:
- Black
- Snap curable
- Fast flow
- Passes NASA outgassing
- Increasing reliability of a small-gap flip-chip
- Heat cure
